2 edition of Mechanical behavior of an axisymmetric solder joint-component system during encapsulation and thermal cycling found in the catalog.
Mechanical behavior of an axisymmetric solder joint-component system during encapsulation and thermal cycling
D. M. Jarboe
by Dept. of Energy, for sale by the National Technical Information Service] in [Washington], [Springfield, Va
Written in English
|Statement||by D. M. Jarboe.|
|Series||BDX ; 613-2172 (rev.)|
|Contributions||United States. Dept. of Energy., Bendix Corporation. Kansas City Division. Communications Services.|
|The Physical Object|
|Pagination||27 p. :|
|Number of Pages||27|
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