Mechanical behavior of an axisymmetric solder joint-component system during encapsulation and thermal cycling

by D. M. Jarboe

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Published 1979 by Dept. of Energy, for sale by the National Technical Information Service] in [Washington], [Springfield, Va .
Written in English

Subjects:

• Solder and soldering.,
• Joints (Engineering)

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Edition Notes

Statement	by D. M. Jarboe.
Series	BDX ; 613-2172 (rev.)
Contributions	United States. Dept. of Energy., Bendix Corporation. Kansas City Division. Communications Services.
The Physical Object
Pagination	27 p. :
Number of Pages	27
ID Numbers
Open Library	OL17651077M

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