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Sunday, May 3, 2020 | History

2 edition of Mechanical behavior of an axisymmetric solder joint-component system during encapsulation and thermal cycling found in the catalog.

Mechanical behavior of an axisymmetric solder joint-component system during encapsulation and thermal cycling

D. M. Jarboe

Mechanical behavior of an axisymmetric solder joint-component system during encapsulation and thermal cycling

by D. M. Jarboe

  • 153 Want to read
  • 4 Currently reading

Published by Dept. of Energy, for sale by the National Technical Information Service] in [Washington], [Springfield, Va .
Written in English

    Subjects:
  • Solder and soldering.,
  • Joints (Engineering)

  • Edition Notes

    Statementby D. M. Jarboe.
    SeriesBDX ; 613-2172 (rev.)
    ContributionsUnited States. Dept. of Energy., Bendix Corporation. Kansas City Division. Communications Services.
    The Physical Object
    Pagination27 p. :
    Number of Pages27
    ID Numbers
    Open LibraryOL17651077M


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Mechanical behavior of an axisymmetric solder joint-component system during encapsulation and thermal cycling by D. M. Jarboe Download PDF EPUB FB2